Method of mounting an electronic power component

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29840, 156293, 228175, 22818022, 361688, H05K 334

Patent

active

059157542

ABSTRACT:
A method of mounting an electronic power component to a cooling element includes finishing at least a bonding area of the cooling element with a finish for use during soldering, forming an indentation in the bonding area of the cooling element, placing adhesive in the indentation, attaching the power component to the cooling element using the adhesive, and thereafter soldering the power component to the cooling element. The finishing melts during soldering and the adhesive prevents shifting of the power component on the cooling element during soldering. Alternatively, the power component is attached to a printed circuit board by adhesive bonding prior to soldering.

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patent: 5182632 (1993-01-01), Bechtel et al.
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Copy of European Search Report dated Apr. 15, 1997.

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