Method of mounting an electronic part

Details Method of mounting an electronic part Method of mounting an electronic part

2007-02-27

2007-02-27

Tugbang, A. Dexter (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S741000, C029S743000, C029S759000, C029S836000

Reexamination Certificate

active

10978365

ABSTRACT:
The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

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