Method of mounting a surface-mountable IC to a converter board

Details Method of mounting a surface-mountable IC to a converter board Method of mounting a surface-mountable IC to a converter board

1992-07-15

1994-10-04

Vo, Peter Dungba

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29838, 361764, 361774, H05K 334

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active

053513932

ABSTRACT:
A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed circuit board. The converter board assembly includes an array of spaced apart pins, arranged in rows and columns for mounting, and a plurality of spaced apart pin pads connected thereto. The pin pads are sufficiently spaced apart to avoid interference. A set of surface-mount lead pads is part of the converter board and is interconnected to the array of pins by a plurality of lead traces. The method of making the converter board with a surface-mount integrated circuit device includes forming or reforming the leads of the device to align with the surface-mount pads.

REFERENCES:
patent: 4812421 (1989-03-01), Jung et al.
patent: 4816427 (1989-03-01), Dennis
patent: 4827611 (1989-05-01), Pai et al.
patent: 4831723 (1989-05-01), Kaufman
patent: 5030144 (1991-07-01), Seidler

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