Method of mounting a substrate structure to a circuit board

Details Method of mounting a substrate structure to a circuit board Method of mounting a substrate structure to a circuit board

1987-01-21

1988-07-19

Rosenbaum, Mark

Electricity: electrical systems and devices

Miscellaneous

29827, 29834, 361388, 361406, H05K 118, H05K 308

Patent

active

047589272

ABSTRACT:
A substrate structure having contact pads is mounted to a circuit board which has pads of conductive material exposed at one main face of the board and has registration features which are in predetermined positions relative to the contact pads of the circuit board. The substrate structure is provided with leads which are electrically connected to the contact pads of the substrate structure and project from the substrate structure in cantilever fashion. A registration element has a plate portion and also has registration features which are distributed about the plate portion and are engageable with the registration features of the circuit board, and when so engaged, maintain the registration element against movement parallel to the general plane of the circuit board. The substrate structure is attached to the plate portion of the registration element so that the leads are in predetermined position relative to the registration features of the registration element. The registration features of the registration element are brought into engagement with the registration features of the circuit board, and in this position of the registration element the leads of the substrate structure overlie the contact pads of the circuit board. A clamp member maintains the leads in electrically conductive pressure contact with the contact pads of the circuit board.

REFERENCES:
patent: 3469684 (1969-09-01), Keady et al.
patent: 3872583 (1975-03-01), Beall et al.
patent: 4255003 (1981-03-01), Berg
patent: 4390220 (1983-06-01), Benasutti
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4658330 (1987-04-01), Berg
patent: 4658331 (1987-04-01), Berg
patent: 4688147 (1987-08-01), Ono

Affiliated with

Also associated with

Rating

Method of mounting a substrate structure to a circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of mounting a substrate structure to a circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of mounting a substrate structure to a circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-600902