Method of mounting a silicon pellet on a ceramic substrate

Details Method of mounting a silicon pellet on a ceramic substrate Method of mounting a silicon pellet on a ceramic substrate

1981-09-29

1984-03-20

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Electrical device making

29589, 357 80, 174 52FP, H01L 2158

Patent

active

044372280

ABSTRACT:
A semiconductor device in which a silicon pellet is mounted on a ceramic substrate by means of a glass material of low melting point. To prevent the silicon pellet from being destroyed under thermal stress, the pellet is bonded to the glass material of low melting point through interposition of an adhesion reinforcing film such as an aluminium film capable of exhibiting a good wettability and a great bonding strength.

REFERENCES:
patent: 3828425 (1974-08-01), Manus
patent: 4262165 (1981-04-01), Ohwaki et al.

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