Method of mounting a semiconductor element for analyzing failure

Details Method of mounting a semiconductor element for analyzing failure Method of mounting a semiconductor element for analyzing failure

1980-08-21

1984-02-14

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324 96, 324158D, G01R 3122

Patent

active

044319673

ABSTRACT:
A semiconductor chip having its main face coated with an electrically insulating film is encapsulated in a plastic, electrically conducting member disposed on a metallic plate so that the surface of the insulating member is exposed and parallel to the metallic plate. The surface of the insulating film is observed by an optical microscope through a nematic liquid crystal film and a glass slide with a transparent, electrically conducting coating successively disposed on the chip with a DC voltage applied between the conducting coating and the metallic plate.

REFERENCES:
patent: Re13798 (1914-09-01), Pickard
Keen; J. M., "Nondestructive Optical . . . ;" Electronics Letters; Jul. 29, 1979; vol. 7; No. 15; pp. 432-433.
Salvo; C. J.; "A Improved Approach . . . ;" 14th Annual Proc., Reliability Physics 1976; Apr. 20-22, 1976; pp. 263-274.
Heilmeier et al.; "Dynamic Scattering . . . ;" Proc. of the IEEE; vol. 56; No. 7; 1968; pp. 1162-1171.

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