Method of mounting a semiconductor device to a heat sink

Details Method of mounting a semiconductor device to a heat sink Method of mounting a semiconductor device to a heat sink

1993-04-19

1994-12-06

Vo, Peter Dungba

Metal working

Method of mechanical manufacture

Electrical device making

29741, H05K 1304, B23P 1904

Patent

active

053698797

ABSTRACT:
A method of mounting a semiconductor device to a heat sink where an opening in the circuit board is formed and sized to allow the semiconductor device to pass therethrough, where a heat sink is positioned on one side of the circuit board and a load is introduced on a second side of the circuit board and applied to the semiconductor device forcing it against the heat sink.

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