Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-08-02
1998-09-29
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29843, 29844, 29874, 228 45, 22818022, H05K 330, H01R 4316
Patent
active
058131159
ABSTRACT:
When a semiconductor chip is mounted on a wiring substrate, an end of a metallic wire fed through a capillary is first fused to form a ball, which is in turn pressed against and bonded to an electrode pad formed on a semiconductor chip. The metallic wire is then cut at a location in the proximity of the ball so that a portion of the metallic wire remains as a protruding contact on the ball. The protruding contact is pressed against a shaping platform coated with a paste-like electrically-conductive adhesive film to thereby cause the protruding contact to have a given height and transfer a portion of the adhesive film to the protruding contact. The protruding contact is eventually bonded to an electrically-conductive film formed on the wiring substrate via the transferred portion of the adhesive film.
REFERENCES:
patent: 3646670 (1972-03-01), Maeda et al.
patent: 4661192 (1987-04-01), McShane
patent: 4914814 (1990-04-01), Behun et al.
patent: 5060843 (1991-10-01), Yasuzato et al.
patent: 5090119 (1992-02-01), Tsuda et al.
patent: 5172851 (1992-12-01), Matsushita et al.
Horimoto Setsuo
Misawa Yoshihiko
Morita Koichi
Saeki Keiji
Echols P. W.
Matsushita Electric - Industrial Co., Ltd.
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