Optical: systems and elements – Lens – With support
Patent
1999-03-18
2000-11-07
Epps, Georgia
Optical: systems and elements
Lens
With support
313 35, 257680, G02B 702
Patent
active
06144507&
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a method of mounting a sealed assembly on a mounting substrate and an optical transducer.
BACKGROUND ART
Mounting arrangements in which an element or the like is mounted directly on a substrate are known generically as COX (where X is B, G, or the like).
Of these, COG (Chip On Glass) is, as shown in FIG. 13, a form of mounting in which an element is mounted on a glass substrate by, for example, face-down bonding.
A liquid crystal display device shown in FIG. 13 has a glass substrate (base member) 3000, an opposing substrate (sealing member) 3100 and a sealing material 3200, in which a liquid crystal material is sealed. Elements including drive ICs 3300 and 3400 are mounted on the glass substrate 3000.
FIG. 14 shows another example of a COG mounting. In FIG. 14, a CCD (Charge Coupled Device) chip 3600 is face-down bonded on a transparent glass substrate 3010 with bumps 3700 interposed. An IC chip 3310 is also face-down bonded on the glass substrate 3010 with bumps 3710 interposed therebetween. It should be noted that in FIG. 14, reference numerals 3800, 3810, and 3820 indicate wiring layers.
It is essential for the liquid crystal display device shown in FIG. 13 to construct the base member with the glass substrate 3000, since it is required to transmit light. The optical transducer, as in the CCD chip 3600 shown in FIG. 14, has a light receiving surface (or light emitting surface) positioned on the same surface as the bumps. For this reason, a transparent substrate such as the glass substrate 3010 shown in FIG. 14 must be used.
It is, however, difficult to form a layered conductor construction on the glass substrate, thus there are limits to high-density mounting.
The present invention is made in the light of such problems. The object of the present invention is the provision of a new mounting technology such that a sealed assembly in which an optical transducer to be required to allow light to pass or a liquid crystal or the like is sealed can be mounted on a mounting substrate at high density, both easily and at low cost.
SUMMARY OF THE INVENTION
The method of mounting a sealed assembly on a mounting substrate of the present invention is a method of mounting a sealed assembly, being of projecting form and having a sealing member fixed to a portion of a base member in such a way as to project from the base member, on a mounting substrate, comprising:
a step of providing an opening portion in a portion of the mounting substrate, and providing a conductive junction portion on a surface of the base member outside of the sealing member; and
with at least a part of the sealing member positioned within the opening portion of the mounting substrate, a step of connecting the conductive junction portion to a wire on the mounting substrate.
In the present invention, the sealed assembly is mounted on the mounting substrate by face-down bonding, using a conductive junction portion such as a conductive projection (bump).
In this case, the sealed assembly has a certain thickness (at least the sum thickness of the base member and sealing member). In particular, when it is seen from the base member, the sealed assembly projects by the thickness of the sealing member. Attempting to carry out face-down bonding with such a sealed assembly means that the conductive junction portion formed on the base member (for example bump electrodes) does not reach the mounting substrate, thus interfering with face-down bonding (face-down bonding may in some cases not be possible).
Here a certain opening portion is provided in the mounting substrate, at least a portion of a sealing member of the sealed assembly is inserted in the opening portion, and the thickness of the sealing member of the sealed assembly clears the printed wiring board in the thickness direction. Thus, face-down bonding is made possible.
By adoption of this mounting technique, since the airtight sealed assembly can be joined to the mounting substrate not by individual connections such as wiring connection, but in
REFERENCES:
patent: 4760440 (1988-07-01), Bigler et al.
patent: 5134340 (1992-07-01), Haitz
patent: 5847650 (1998-12-01), Zhou et al.
Epps Georgia
Seiko Epson Corporation
Thompson Timothy
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