Method of mounting a plurality of electronic parts on a circuit

Metal working – Method of mechanical manufacture – Electrical device making

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29825, 29840, H05K 330

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active

061581151

ABSTRACT:
A method of mounting electronic parts on a circuit board comprises an adhesive layer formation step of forming, on an electrode surface of each electronic part on which electrodes are formed, a film-like thermosetting adhesive layer having an area substantially equal to that of the corresponding electrode surface so as to obtain adhesive-coated electronic parts. The electrodes on which the adhesive layer is formed are arranged so as to face corresponding electrodes of the circuit board, and the electrodes are positioned relative to each other. Heat and pressure are applied to the electrodes of the electronic parts and the electrodes of the circuit board to fix the electrodes to each other after the electrodes are positioned. Almost no adhesive superfluously comes out of the electrode surfaces. Accordingly, when mounting the electronic parts on the circuit board, it is unnecessary to remove superfluous adhesive, unlike conventional process, whereby the efficiency is improved and also the cost can be cut down.

REFERENCES:
patent: 4554033 (1985-11-01), Dery et al.
patent: 5571594 (1996-11-01), Minowa et al.
patent: 5628111 (1997-05-01), Iwasaki et al.
patent: 5714252 (1998-02-01), Hogerton et al.
patent: 5879761 (1999-03-01), Kulesza et al.
Patent Abstracts of Japan, vol. 016, No. 472 (E-1272), Sep. 30, 1992 & JP 04 169080A (Shin Etsu Polymer Co. Ltd), Jun. 17, 1992.

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