Method of mounting a plurality of coupons in molded material and

Details Method of mounting a plurality of coupons in molded material and Method of mounting a plurality of coupons in molded material and

1985-04-18

1986-11-18

Anderson, Philip

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Surface finishing

264263, 2642711, 26427217, 356244, B29C 3910, B29C 3702

Patent

active

046235000

ABSTRACT:
Method and apparatus for high volume preparation of cross-sectional specimens of printed circuit boards for microscopic examination, including a method and apparatus for precision mounting of a large number of such cross sections in a single molding sequence for simultaneous polishing of such cross sections in a single polishing operation.

REFERENCES:
patent: 2378252 (1945-06-01), Staehle et al.

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