Method of mounting a piezoelectric element

Details Method of mounting a piezoelectric element Method of mounting a piezoelectric element

1996-11-14

1998-12-22

Hall, Carl E.

Metal working

Piezoelectric device making

310324, 310344, H01L 4122

Patent

active

058506772

ABSTRACT:
An opening is formed in a region of a circuit board opposite a vibration region E of a piezoelectric element. The piezoelectric element is mounted to the circuit board, and electrical connections extend between and support the piezoelectric element from the circuit board by a solder. The soldered connection portions are surrounded by a bonding agent. An opening in the circuit board prevents any excess bonding agent from invading the vibration region E of the piezoelectric element, and the bonding agent assists in dispersing stresses exerted on the circuit board thereby minimizing the stresses transferred to the piezoelectric element.

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patent: 5185550 (1993-02-01), Morita et al.
patent: 5235135 (1993-08-01), Knecht et al.
patent: 5291460 (1994-03-01), Harada et al.

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