Method of mounting a light emitting chip and an optical fiber on

Details Method of mounting a light emitting chip and an optical fiber on Method of mounting a light emitting chip and an optical fiber on

1990-03-08

1991-03-05

Lee, John D.

350320, G02B 642

Patent

active

049972430

ABSTRACT:
In a photoelectric device, particularly, a photoelectric device for optical communication, an optical fiber is fixed at two fixing points so that the extremity of the optical fiber is disposed opposite to the light emitting surface of a laser diode chip and the optical fiber extends in a nonlinear shape, for example, in a moderate curve, between the two fixing points. Even though holding members fixedly holding the optical fiber at the two fixing points and a base member supporting the holding members are formed of a metal or metals having a coefficient of thermal expansion far greater than that of the optical fiber, and even if the distance between the two fixing points is varied due to the thermal expansion or contraction of the holding members and the base member, the optical fiber is obliged only to change the shape of extension. Therefore, the optical fiber and the solder fixing the optical fiber to the holding members at the two fixing points are not subjected to repeated stress, and hence the fatigue of the optical fiber and the solder is avoided. Accordingly, the photoelectric device is able to continue stable optical communication regardless of temperature variation.

REFERENCES:
patent: 4708429 (1987-11-01), Clark et al.
patent: 4752109 (1988-06-01), Gordon et al.
patent: 4803361 (1989-02-01), Aiki et al .
patent: 4920262 (1990-04-01), Aiki et al.

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