Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-01-03
1998-07-28
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29832, 257668, 257698, H05K 334
Patent
active
057847800
ABSTRACT:
A package for mounting a semiconductor device to a circuit board. An insulating substrate is provided, which has at least one layer, and provides rigidity to the package. A plurality of electrically conductive contacts are disposed on the top surface of the substrate, receive the semiconductor device, and make electrical contact between the semiconductor device and the substrate. A plurality of electrically conductive through-holes are formed in the substrate, and extend from the top surface of the substrate to the bottom surface of the substrate. The through-holes make electrical connection between all of the layers of the substrate. Electrical interconnections between the contacts and the through-holes are provided by a plurality of electrically conductive traces. A z-conductive layer is attached to the bottom surface of the substrate. Electrical continuity between the bottom surface of the z-conductive layer and the through-holes extending to the bottom surface of the substrate is substantially limited to the z axis of the z-conductive layer according to a predetermined pitch. A plurality of electrically conductive connectors are attached to the bottom surface of the z-conductive layer, and are disposed so as to be in electrical contact through the z-conductive layer with no more than one through-hole.
REFERENCES:
patent: 3705332 (1972-12-01), Parks
patent: 4667401 (1987-05-01), Clements et al.
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 4970780 (1990-11-01), Suda et al.
patent: 5065227 (1991-11-01), Frankeny et al.
patent: 5084961 (1992-02-01), Yoshikawa
patent: 5157477 (1992-10-01), Chance
patent: 5203076 (1993-04-01), Banerji et al.
patent: 5292688 (1994-03-01), Hsiao et al.
patent: 5381039 (1995-01-01), Morrison
patent: 5386624 (1995-02-01), George et al.
patent: 5434452 (1995-07-01), Higgins, III
patent: 5521435 (1996-05-01), Mizukoshi
Arbes Carl J.
LSI Logic Corporation
LandOfFree
Method of mounting a flip-chip does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of mounting a flip-chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of mounting a flip-chip will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-13510