Method of mounting a connection component on a semiconductor chi

Details Method of mounting a connection component on a semiconductor chi Method of mounting a connection component on a semiconductor chi

1996-06-05

1999-03-02

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29827, 29834, 29841, 29855, 156 87, 156295, 156499, 438125, H05K 1304, H05K 338

Patent

active

058755454

ABSTRACT:
A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.

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