Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
1998-12-03
2001-06-05
Chaudhuri, Olik (Department: 2814)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S065000, C438S108000, C438S125000
Reexamination Certificate
active
06242274
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a method of mounting on a unit a chip that has at least one optical active surface and to an arrangement for mounting on a unit a chip that has at least one optical surface, such as for mounting a chip on an optical miniature capsule. Surface mounted and/or encapsulated optoelectrical elements, such as photo-detectors (PD), light-emitting diodes (LED) or laser diodes (LD), possibly integrated with other electronic elements, are often mounted on miniature capsules so as to be easy to handle.
DESCRIPTION OF THE PRIOR ART
When using an optical fibre for high speed communication, a permanent connection is often provided between the optical fibre and an active surface on an optical component, such as an optical transmitter or an optical receiver. This connection requires the end of the optical fibre to be matched very precisely with a well-defined region on the optical component. It is therefore usual for the component to be encapsulated together with a permanently mounted optical fibre length, a so-called pigtail, such that a small permanently mounted fibre will constantly hang from the capsule
100
. The encapsulation may be effected hermetically with a metal or ceramic material. This component encapsulating method is time-consuming, highly expensive, takes up a large volume and does not permit the encapsulated components to be connected to and released from an optical fibre.
U.S. Pat. Nos. 5,168,537, 5,199,093, 5,230,030, 5,249,245, 5,309,537, 5,337,391 and 5,420,954 teach earlier known methods and arrangements for connecting optical fibres to optical transmitters or receivers with the aid of some form of interconnecting means, where the separate optical fibre end is brought directly onto an active surface on an optoelectrical element with the aid of different types of guide means.
SUMMARY OF THE INVENTION
With the intention of simplifying an arrangement of a chip having at least one optical active surface and positioning the chip in a correct position in relation to an optical miniature capsule for optimum light transmission between an optical fibre and the optically active surface, the chip is fastened on a foil which has at least one conductor and which is provided with alignment marks and/or guide means for correct positioning of the chip on the foil and for correct positioning of the foil and the mounted chip on the capsule.
After having fastened the chip on the foil, the foil and chip assembly can be readily fastened to the capsule. By using guide means, for instance contact element guide pins on the capsule, the foil and chip assembly can be positioned correctly in relation to the capsule, such that the ends of the optical fibres in the contact element will lie opposite to and in contact with the optically active surfaces of the chip and therewith provide optimum light transmission.
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Burns Doane Swecker & Mathis L.L.P.
Chambliss Alonzo
Chaudhuri Olik
Telefonaktiebolaget LM Ericsson (publ)
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