Measuring and testing – Vibration – By mechanical waves
Patent
1989-12-01
1991-04-23
Williams, Hezron E.
Measuring and testing
Vibration
By mechanical waves
73599, G01N 2920
Patent
active
050091026
ABSTRACT:
Reference materials of differing indices of refraction or acoustic impedances are incorporated into liquid compositions to monitor the solidification process of these liquid compositions. Light or acoustic waves are used to indirectly measure the difference between the index of refraction or acoustic impedance of the solidfying composition and the reference material. The method provides an accurate in situ indication of the completion of the solidification process as well as a monitor of the degree of solidification during the solidification process.
REFERENCES:
patent: 4412451 (1983-11-01), Uusitalo et al.
patent: 4590803 (1986-05-01), Harrold
patent: 4798954 (1989-01-01), Stevenson
patent: 4867167 (1989-09-01), Magnin
Harrold et al., "Non-Destructive Evaluation of the Curing of Resin and Prepreg Using an Acoustic Waveguide Sensor," From: Review of Progress in Quantitative Nondestructive Evaluation, vol. 6B, pp. 1277-1285, Edited by Donald O. Thompson and Dale E. Chimenti (Plenum Publishing Corporation, 1987).
Lindrose, A. M., "Ultrasonic Wave and Moduli Changes in a Curing Epoxy Resin," Experimental Mechanics, pp. 227-232, Jun. 1978.
Harrold et al., "Material Cure and Internal Stresses Monitored Via Embedded Acoustic Waveguides," Reprinted from: Proceedings of ICTTE 86 Technology Shaping Our Future, 1986 International Congress on Technology and Technology Exchange, Pittsburgh, Pa., Oct. 6-8, 1986.
Rokhlin et al., "Real-Time Study of Frequency Dependence of Attenuation and Velocity of Ultrasonic Waves During the Curing Reaction of Epoxy Resin," J. Acoust. Soc. Am., vol. 79(6), pp. 1786-1793, Jun. 1986.
Board of Regents of the University of Washington
Finley Rose M.
Williams Hezron E.
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