Method of molding using compact molding apparatus

Details Method of molding using compact molding apparatus Method of molding using compact molding apparatus

2005-03-29

2005-03-29

Ortiz, Angela (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

Direct application of fluid pressure differential to...

Producing multilayer work or article

C264S252000, C264S259000, C264S275000

Reexamination Certificate

active

06872353

ABSTRACT:
A molding method utilizing a moveable mold platen which may hold, have affixed to, or carry a first portion of a mold or molds. A second or door platen may hold, have affixed to, or carry a second portion of a mold or molds. The door platen is placed in its closed position, and the moveable mold platen is brought up adjacent to it, so that the two portions of the mold are brought into engagement with one another. A desired molding material is injected into the mold cavity, after which the moveable platen is retracted, the door platen is opened, and the part is removed. A part to be encapsulated may be placed into the mold before the two portions of the mold are brought into engagement.

REFERENCES:
patent: 3577591 (1971-05-01), Ricards et al.
patent: 3981671 (1976-09-01), Edwards
patent: 4072458 (1978-02-01), Schlieckmann
patent: 4354819 (1982-10-01), Wirz
patent: 5033955 (1991-07-01), Faig et al.
patent: 6123535 (2000-09-01), Ash et al.
patent: 6461137 (2002-10-01), Ash et al.
patent: 6495082 (2002-12-01), Ash et al.
patent: 6511310 (2003-01-01), Ash et al.
patent: 6626659 (2003-09-01), Ash et al.

Affiliated with

Also associated with

Rating

Method of molding using compact molding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of molding using compact molding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of molding using compact molding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3446577