Metal founding – Process – Shaping liquid metal against a forming surface
Reexamination Certificate
2006-04-25
2006-04-25
Lin, Kuang Y. (Department: 1725)
Metal founding
Process
Shaping liquid metal against a forming surface
C164S900000
Reexamination Certificate
active
07032640
ABSTRACT:
A method of molding a low melting point metal alloy which exhibits thixotropy properties at a solid-liquid coexisting temperature, said method comprising the steps of heating said metal alloy at a temperature in the solid-liquid coexisting temperature region to form a semisolid, supplying said semisolid to a heating/holding cylinder to be accumulated, and injecting said semisolid into a mold. At the end of the molding process, a remaining semisolid material is heated to a wholly molten state, then discharged by injection, and heating is stopped so that the molding operation is finished; or, at a temporary suspension of molding, an accumulated material is heated to a wholly molten state and, at the resumption of molding, the temperature of the heating holding cylinder is lowered to the original solid-liquid coexisting temperature region while discharging said wholly molten material by injection and resupplying with new semisolid molding material.
REFERENCES:
patent: 2001/0020526 (2001-09-01), Motegi et al.
patent: 2004/0182537 (2004-09-01), Takizawa et al.
patent: 2001-252759 (2001-09-01), None
patent: 2003-200249 (2003-07-01), None
Anzai Kazuo
Takei Koji
Yamazaki Ko
Lin Kuang Y.
Nissei Plastic Industrial Co. Ltd.
Weingarten Schurgin, Gagnebin & Lebovici LLP
LandOfFree
Method of molding low melting point metal alloy does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of molding low melting point metal alloy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of molding low melting point metal alloy will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3567752