Method of molding low melting point metal alloy

Metal founding – Process – Shaping liquid metal against a forming surface

Reexamination Certificate

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C164S900000

Reexamination Certificate

active

07032640

ABSTRACT:
A method of molding a low melting point metal alloy which exhibits thixotropy properties at a solid-liquid coexisting temperature, said method comprising the steps of heating said metal alloy at a temperature in the solid-liquid coexisting temperature region to form a semisolid, supplying said semisolid to a heating/holding cylinder to be accumulated, and injecting said semisolid into a mold. At the end of the molding process, a remaining semisolid material is heated to a wholly molten state, then discharged by injection, and heating is stopped so that the molding operation is finished; or, at a temporary suspension of molding, an accumulated material is heated to a wholly molten state and, at the resumption of molding, the temperature of the heating holding cylinder is lowered to the original solid-liquid coexisting temperature region while discharging said wholly molten material by injection and resupplying with new semisolid molding material.

REFERENCES:
patent: 2001/0020526 (2001-09-01), Motegi et al.
patent: 2004/0182537 (2004-09-01), Takizawa et al.
patent: 2001-252759 (2001-09-01), None
patent: 2003-200249 (2003-07-01), None

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