Method of molding low melting point metal alloy

Details Method of molding low melting point metal alloy Method of molding low melting point metal alloy

2006-05-02

2006-05-02

Lin, Kuang Y. (Department: 1725)

Metal founding

Process

Shaping liquid metal against a forming surface

C164S900000

Reexamination Certificate

active

07036551

ABSTRACT:
The present invention relates to a method of molding a low-melting-point metal alloy which exhibits thixotropy properties in a solid-phase and liquid-phase coexisting temperature region. In this method, a temperature of a heating holding cylinder is increased to a liquidus temperature or higher at the start of a molding operation. Then a remaining material in the preceding molding remaining in the heating holding cylinder in a solid state is wholly melted. After that a temperature of the heating holding cylinder is lowered to a temperature in the solid-phase and a liquid-phase coexisting temperature region. At the same time a molding material is supplied and a provisional molding is carried out. After the temperature has reached the solid-phase and liquid-phase coexisting temperature region, a regular molding is started. By the present invention a problem of a remaining material in the heating holding cylinder, which becomes a trouble at the start of molding by injection, is solved.

REFERENCES:
patent: 2001/0020526 (2001-09-01), Motegi et al.
patent: 2004/0182537 (2004-09-01), Takizawa et al.
patent: 2001-252759 (2001-09-01), None
patent: 2003-200249 (2003-07-01), None

Affiliated with

Also associated with

Rating

Method of molding low melting point metal alloy does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of molding low melting point metal alloy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of molding low melting point metal alloy will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3561775