Plastic and nonmetallic article shaping or treating: processes – With measuring – testing – or inspecting
Patent
1999-02-12
2000-10-31
Ortiz, Angela
Plastic and nonmetallic article shaping or treating: processes
With measuring, testing, or inspecting
264104, 264108, 26432812, 264105, B29C 7062, B29C 6724
Patent
active
061397830
ABSTRACT:
A method of molding a thermally conductive article for transferring heat from a heat generating surface is provided. A mold assembly is first provided which is capable of forming an article of a desired configuration. The initial location of contact on the article with the heat generating surface is then determined. An input gate is formed in the mold assembly at the initial location of contact. The optimum heat flow path through the article is determined. A termination location of the heat flow path is determined. Polymer, loaded with conductive filler, is introduced into the mold assembly via the input gate. Venting is provided in the mold assembly at the termination location of the heat flow path. Polymer is positioned in the mold assembly with the conductive filler being substantially parallel and aligned with the heat flow path. Finally, the molded article is ejected from the mold assembly. With the molding method of the present invention, thermal conductivity of articles may be increased several times over the thermal conductivity realized with conventional molding methods.
REFERENCES:
patent: 4113812 (1978-09-01), Talbott et al.
patent: 4778635 (1988-10-01), Hechtman et al.
patent: 4839112 (1989-06-01), Wynne et al.
patent: 5011728 (1991-04-01), Imae et al.
patent: 5017312 (1991-05-01), Peters et al.
patent: 5045972 (1991-09-01), Supan et al.
patent: 5066449 (1991-11-01), Kato et al.
patent: 5149482 (1992-09-01), Sorensen
patent: 5223281 (1993-06-01), Hehl
patent: 5262112 (1993-11-01), Sorensen
patent: 5366688 (1994-11-01), Terpstra et al.
patent: 5388983 (1995-02-01), Hehl
patent: 5492467 (1996-02-01), Hume et al.
patent: 5523049 (1996-06-01), Terpstra et al.
patent: 5580512 (1996-12-01), Koon et al.
patent: 5674439 (1997-10-01), Hume et al.
patent: 5705008 (1998-01-01), Hecht
patent: 5834337 (1998-11-01), Unger et al.
patent: 5846356 (1998-12-01), Vyakarnam et al.
patent: 5858301 (1999-01-01), Hashimoto
patent: 5888340 (1999-03-01), Vyakarnam et al.
Chip Coolers, Inc.
Ortiz Angela
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