Method of molding a solid state image pickup device

Details Method of molding a solid state image pickup device Method of molding a solid state image pickup device

1989-08-21

1992-03-24

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

264 17, 26427217, 357 72, 425117, B29C 3910

Patent

active

050986309

ABSTRACT:
A solid-state image pickup device comprises a semiconductor chip, a package with a recess in which said semiconductor chip is fixed, and a transparent protective member for protecting an image pickup surface of the semiconductor chip and guiding a light image onto the image pickup surface. The transparent protective member includes a transparent resin layer for covering the image pickup surface and the upper surface of the package without forming a space therebetween, and an incident surface formed on the resin layer in parallel to the image pickup surface. A method manufactures a solid-state image pickup device having a construction described above by using a mold.

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