Method of molding a semiconductor device

Details Method of molding a semiconductor device Method of molding a semiconductor device

1989-01-11

1990-03-13

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

2643284, 26432812, B29C 4502, B29C 4514

Patent

active

049081780

ABSTRACT:
A metal mold for plastic molding a semiconductor device by a transfer-molding method with the use of thermo-hardening plastics. The mold includes a pot section into which plastic is injected; a cavity section where a product is formed; a runner section constituting a path for the plastic from the pot section to the cavity section; a gate section provided between the runner section and the cavity section so as to reduce the cross-sectional area for the flow of the plastic which flows therethrough from the runner section to the cavity section; a flow restriction section provided in the path of the runner section so as to reduce the cross-sectional area of the flow of plastic.

REFERENCES:
patent: 1918532 (1933-07-01), Geyer
patent: 2239338 (1939-11-01), Norelli
patent: 2672653 (1952-03-01), Simpkins et al.
patent: 3270377 (1966-09-01), Parker
patent: 3659821 (1972-05-01), Sakamoto et al.
patent: 4334847 (1982-06-01), Schauffele
patent: 4513942 (1985-04-01), Creasman
patent: 4599062 (1986-07-01), Konishi
patent: 4611983 (1986-09-01), Bielfeldt

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