Method of molding a pin holder on a lead frame

Details Method of molding a pin holder on a lead frame Method of molding a pin holder on a lead frame

1988-08-25

1990-04-24

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Carbonizing to form article

Agglomeration or accretion

26427217, 264273, 264277, B29C 3508, B29C 3910

Patent

active

049198572

ABSTRACT:
A method of molding a pin holding structure on a lead frame having a plurality of inner lead pins associated with an island, wherein fluid resinous material is dispensed across successive ones of the inner lead pins and is then hardened while under pressure between flat presser plates. The resin is high in heat resistance as well as in purity, electrical non-conductivity, and low in linear expansibility.

REFERENCES:
patent: 4264549 (1981-04-01), Utner
patent: 4287226 (1981-09-01), Pirvics et al.
patent: 4374080 (1983-02-01), Schroeder
patent: 4540603 (1985-09-01), Hidaka et al.
patent: 4733014 (1988-03-01), Fierkens
patent: 4733292 (1988-03-01), Jarvis

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