Method of molding a carrier ring to leads

Details Method of molding a carrier ring to leads Method of molding a carrier ring to leads

1990-12-14

1993-01-26

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427217, 2643284, 2643285, 26432812, 425544, B29C 4502, B29C 4558

Patent

active

051820714

ABSTRACT:
Molding carrier structures to leads of existing semiconductor packages is accomplished by molding at temperatures which maintain approximately matched thermal expansion between an encapsulating material and leads of the semiconductor package. The matched thermal expansion is provided by molding at temperatures below that which is required for glass transition of the encapsulating material. Molding at such temperatures is facilitated by a molding assembly that has a molding pot with an irregular shaped bottom which fluidizes the encapsulating material at low temperatures. Molding at temperatures that essentially match thermal expansion between the package's leads and the encapsulating material prevents damaging the leads of the package.

REFERENCES:
patent: 3989793 (1976-11-01), Hertel et al.
patent: 4006210 (1977-02-01), Denton
patent: 4554126 (1985-11-01), Sera
patent: 4708613 (1987-11-01), Sera et al.
patent: 4837187 (1989-06-01), Lin et al.
Dictionary of Plastics, Wordingham, J. Author, Hamlyn Publishing Group Ltd., Co. 1968, pp. 10 and 65.

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