Etching a substrate: processes – Gas phase etching of substrate – Etching inorganic substrate
Reexamination Certificate
2011-05-10
2011-05-10
Lester, Evelyn A. (Department: 2873)
Etching a substrate: processes
Gas phase etching of substrate
Etching inorganic substrate
C216S006000, C216S058000, C216S072000, C310S309000, C310S066000, C318S116000, C359S290000
Reexamination Certificate
active
07938977
ABSTRACT:
A torsional MEMS device is disclosed. The torsional MEMS device includes a support structure, a platform, and at least two hinges, which connects the platform to the support structure. The platform has an active area and a non-active area. A plurality of sacrificial elements is disposed in the non-active area. If the resonant frequency of the torsional MEMS device is less than a predetermined standard resonant frequency of the torsional MEMS device, at least one sacrificial element is removed to reduce the total mass of the torsional MEMS device, and so as to increase the resonant frequency of the torsional MEMS device.
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Ho Hsien-Lung
Huang Long-Sun
Hsu Winston
Lester Evelyn A.
Margo Scott
Touch Micro-System Technology Corp.
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