Method of metallizing non-oxide ceramics

Details Method of metallizing non-oxide ceramics Method of metallizing non-oxide ceramics

1989-12-15

1992-01-21

Heinrich, Samuel M.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228198, 228238, B23K 3102

Patent

active

050821636

ABSTRACT:
A non-oxide ceramic material such as aluminum nitride can be metallized with copper by directly bonding a thin sheet of copper to a substrate of the non-oxide ceramic material instead of using a conventional manner in which a paste comprising a powder of copper and a binder is applied to a ceramic substrate by printing. This metallization is effected by placing the non-oxide ceramic material either in contact with or in close proximity to copper containing a copper oxide, followed by heating them in a non-oxidizing atmosphere at a temperature lower than the melting point of copper, but at which the dissociation of the copper oxide contained in copper can occur, so as to dissociate at least part of the copper oxide into metallic copper and oxygen to thereby provide a strong bondage between the surfaces of said non-oxide ceramic material and copper. The metallized non-oxide ceramic material can be used as a substrate for use in IC devices.

REFERENCES:
patent: 4811893 (1989-03-01), Kanahara et al.
patent: 4954386 (1990-09-01), Mizunoya et al.

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