Method of metallizing a diamond substrate without using a refrac

Details Method of metallizing a diamond substrate without using a refrac Method of metallizing a diamond substrate without using a refrac

1996-03-25

1997-05-20

King, Roy V.

Coating processes

With post-treatment of coating or coating material

Heating or drying

4273831, 427314, 427250, 427125, 427123, B05D 302

Patent

active

056310463

ABSTRACT:
A method of metallizing a diamond substrate without using a refractory metal by firing the diamond substrate at approximately 850.degree. C. for ten minutes in order to de-hydrogenate and oxidize the surface of the diamond substrate; applying any suitable metal such as gold, silver, or copper in any suitable form as an interconnect layer to the diamond substrate using any suitable technique such as thick-film or direct-write; drying the interconnect layer on the diamond substrate at approximately 150.degree. C. for fifteen minutes in order to remove any volatile solvent that may be contained within the interconnect layer; and firing the diamond substrate and the interconnect layer at approximately 850.degree. C. for ten minutes in order to adhere the interconnect layer to the diamond substrate.

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Lance A.Glasser, A Road Map to ARPA Involvement in Electronic Packaging, Apr. 1993, IEEE pp. 82-86.
Meyyappan et al, Thin Solid Films 253 (1994) pp. 407-412.
Pimenov et al, Appl. Phys. lett. 64(15), Apr. 1994, pp. 1935-1937.

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