Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating resistive material
Patent
1996-05-28
1998-06-16
Chapman, Mark
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating resistive material
216 41, 216105, 216106, 438694, 438703, B44C 122
Patent
active
057664927
ABSTRACT:
A method of metal-plating electrode portions of a printed-wiring board includes copper-plating the overall surface of the printed-wiring board on which an electric circuit has been formed, forming a metal plating resist coating on the copper plated wiring board except for on the electrode portions, and subjecting the electrode portions, which are not covered with the resist coating, to an electrolytic metal plating process, at least once, and then removing the remaining resist coating. The resist coating formation and the electrolytic metal plating process may optionally be repeated a predetermined number of times. An etching resist coating is then formed on the circuit portion including the electrode portions, and the copper-plated portion is then removed except from the circuit portion by etching and then stripping the etching resist coating.
REFERENCES:
patent: 3568312 (1971-03-01), Perricone
patent: 5209817 (1993-05-01), Ahmad et al.
patent: 5620612 (1997-04-01), Kukanskis et al.
Patent Abstracts of Japan, vol. 95, No. 5, Terada Hiroaki, 30 Jun. 1995, 21 Feb. 1995.
Kurosaki Yoshinobu
Nakamoto Johji
Nishijima Kanji
Sadahisa Toshiya
Chapman Mark
International Business Machines - Corporation
Nippon Paint Co. Ltd.
LandOfFree
Method of metal-plating electrode portions of printed-wiring boa does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of metal-plating electrode portions of printed-wiring boa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of metal-plating electrode portions of printed-wiring boa will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1721330