Method of measuring warpage of rear surface of substrate

Details Method of measuring warpage of rear surface of substrate Method of measuring warpage of rear surface of substrate

2007-02-15

2009-02-24

Garber, Charles D. (Department: 2812)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

Reexamination Certificate

active

07494892

ABSTRACT:
A method of measuring warpage of a rear surface of a substrate includes a substrate detection step, a best fit plane calculation step, and a warpage calculation step. Further, the method of measuring warpage of a rear surface of a substrate can further includes after the substrate detection step and before the best fit plane calculation step: a noise removal step and an outer peripheral portion removal step; the outer peripheral portion removal step and a smoothing step; or the noise removal step, the outer peripheral portion removal step, and the smoothing step. Thereby, a method of measuring warpage of a rear surface with a high surface roughness of a substrate can be provided.

REFERENCES:
patent: 6323952 (2001-11-01), Yomoto et al.
patent: 6731391 (2004-05-01), Kao et al.
patent: 2004/0090639 (2004-05-01), Kubo et al.
patent: 2007/0166945 (2007-07-01), Tanabe et al.
Edited by Yoshiaki Matsushita et al., “Superprecision Wafer Surface Contol Technology,” 1st Edition, Feb. 28, 2000, pp. 258-264, pp. 272-278, Published by Science Forum Inc.
“Wafer Geometry Characteristics” XP-002428986.
Search Report dated Apr. 26, 2007.

Affiliated with

Also associated with

Rating

Method of measuring warpage of rear surface of substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of measuring warpage of rear surface of substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of measuring warpage of rear surface of substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4068547