Method of measuring the depth of full-cut dicing grooves by usin

Details Method of measuring the depth of full-cut dicing grooves by usin Method of measuring the depth of full-cut dicing grooves by usin

1994-02-16

1996-03-26

Williams, Hezron E.

Measuring and testing

Vibration

By mechanical waves

437226, 437227, G01S 1588

Patent

active

055011047

ABSTRACT:
The present invention provides a method of measuring the depth of a dicing groove capable of measuring the depth of the groove with a high accuracy when the groove is cut in a full-cut mode, which method employs an ultrasonic detector which emits ultrasonic waves, measures the time interval between the emission of the ultrasonic waves and the return of their echo, the phase difference between the emitted ultrasonic waves and the reflected ultrasonic waves, or both the time interval and the phase difference to measure the depth of the groove, and is featured by determining the depth of the dicing groove on the basis of the depth of the groove formed in an exposed area of the adhesive sheet not occupied by the workpiece.

REFERENCES:
patent: 3813926 (1974-06-01), Stubbeman
patent: 3991296 (1976-11-01), Kojima et al.
patent: 4364264 (1982-12-01), Re Fiorentin
patent: 4814296 (1989-03-01), Jedlicka et al.
patent: 5062297 (1991-11-01), Hashimoto et al.
patent: 5128282 (1992-07-01), Ormond et al.

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