Method of measuring microcrack depth

Details Method of measuring microcrack depth Method of measuring microcrack depth

1986-12-10

1989-04-25

Tarcza, Thomas H.

Communications, electrical: acoustic wave systems and devices

Echo systems

Distance or direction finding

73598, G01S 968

Patent

active

048254231

ABSTRACT:
A method of measuring the depth of a microcrack. A sample which has a crack substantially parallel to the surface and slightly inclined is set in the neighborhood of the focal point of a converging acoustic beam, and the depth of a microcrack of the sample irradiated with the beam is measured on the basis of the phenomenon that the reflected wave intensity assumes a minimum value when the product of the crack depth and the frequency of the acoustic wave is equal to a half integral multiple of the velocity of the acoustic waves in the sample.

REFERENCES:
patent: 2995925 (1961-08-01), Worlton
patent: 3165922 (1965-01-01), Worlton
patent: 4274288 (1981-06-01), Tittmann et al.
patent: 4524621 (1985-06-01), Yamanaka
patent: 4593568 (1986-06-01), Telford et al.
R. D. Weglein; "A Model for Predicting Acoustic Material Signatures", Appl. Phys Lett 34(3), Feb. 1, 1979, pp. 179-181.
T. K. Lockett; Lamb and Torsional waves and the use in flaw . . . Ultrasonics, Jan. 1973.

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