Method of maximizing chip yield for semiconductor wafers

Details Method of maximizing chip yield for semiconductor wafers Method of maximizing chip yield for semiconductor wafers

1997-09-25

2000-05-30

Teska, Kevin J.

Data processing: generic control systems or specific application

Specific application, apparatus or process

Article handling

700110, 700121, 702 84, 702181, 382149, G06F 1750, G06F 1900, G06K 903

Patent

active

060700041

ABSTRACT:
A method of fabricating semiconductor chips includes the steps of optimizing a number of chips that geometrically fit on a wafer and maximizing chip yield for the wafer by considering chips located in a normally rejectable location and utilizing yield probability data for the chip in the normally rejectable locations to weight the probability of an acceptable chip such that if the probability is above a threshold value the chips are not rejected. This results in an increased chip yield for semiconductor wafers.

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