Method of mass-producing integrated circuit devices using strip

Details Method of mass-producing integrated circuit devices using strip Method of mass-producing integrated circuit devices using strip

1989-10-31

1991-07-16

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437220, 174 524, H01L 2198

Patent

active

050325426

ABSTRACT:
A method of mass-producing IC devices includes the steps of: forming a plurality of types of conductor patterns on a ribbonlike insulating substrate, separating the ribbonlike substrate to form a plurality of types of divided substrates, causing at least one of the conductor patterns of the same type to be included in each of the divided substrates, and sending the divided substrates including the conductor patterns of the same type to the same dedicated assembling line.

REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 3821847 (1974-07-01), Melse et al.
patent: 4426773 (1984-01-01), Hargis
patent: 4946633 (1990-07-01), Saeki et al.

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