Method of masking substrates leaving exposed facets

Details Method of masking substrates leaving exposed facets Method of masking substrates leaving exposed facets

1997-06-20

1998-11-17

Bowers, Charles

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Mesa formation

427259, 430311, H01L 21033

Patent

active

058375600

ABSTRACT:
A method of masking a substrate to leave an exposed facet for processing during fabrication of a semiconductor devices including providing a substrate formed of a semiconductor material and having a structure projecting therefrom, the structure including a facet. Ultraviolet light is selectively directing onto the substrate at an angle to the structure and opposite the facet so that the structure shades the facet from the ultra violet light. The ultra violet light reacts with the material to form an oxide mask on the substrate leaving the facet unmasked.

REFERENCES:
patent: 4821094 (1989-04-01), Okazaki et al.

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