Method of marking semiconductors

Details Method of marking semiconductors Method of marking semiconductors

1977-05-16

1979-01-09

Esposito, Michael F.

Coating processes

Nonuniform coating

427 82, 427287, 427288, 427421, 222420, B65D 4718, B05D 500

Patent

active

041339185

ABSTRACT:
A non-contacting, non-clogging, electro-mechanically operated marking device or inker for continuous or intermittently marking a semiconductor wafer die is disclosed together with a method of operating the device. The marking device has an ambient pressure ink reservoir within which is mounted a thin, capillary filament guide tube. A length of filament such as, fishline, is positioned within the tube and secured at one end to the plunger of a solenoid. The distal end of the filament is driven out of the capillary tube by the solenoid to force a small amount of the marking fluid or ink out of the reservoir and onto the die without the filament contacting the die. The solenoid coil is energized by a current pulse having a first current level and a second current level that is less than the first current level. The second current level provides a short holding current for the solenoid to prevent spattering of the marking fluid.

REFERENCES:
patent: 2643801 (1953-06-01), Kollmeyer
patent: 3476291 (1969-11-01), Glaser
patent: 3572558 (1971-03-01), Hooker
patent: 3677447 (1972-07-01), Rentz
patent: 3810779 (1974-05-01), Pickett

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