Method of manufacturing wiring substrate

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S825000, C029S830000, C029S832000, C438S107000, C438S108000, C438S761000

Reexamination Certificate

active

07543374

ABSTRACT:
In a method of manufacturing a wiring substrate according to the present invention, a metal foil is tentatively fixed onto a temporary substrate, which is made of a nonwoven fabric impregnated with resin, by selectively attaching a peripheral side of the metal foil to an outer peripheral portion of a wiring formation region of the temporary substrate, thereafter, a build-up wiring layer is formed on the metal foil, and the metal foil is separated from the temporary substrate by cutting out an inside portion of a structure, the portion being inward from the adhesive layer, in this way, a wiring member including the build-up wiring layer formed on the metal foil is obtained.

REFERENCES:
patent: 6391220 (2002-05-01), Zhang et al.
patent: 6803324 (2004-10-01), Ogawa et al.
patent: 7152314 (2006-12-01), Shuto et al.
patent: 7377030 (2008-05-01), Shuto et al.
patent: 2003/0162386 (2003-08-01), Ogawa et al.
patent: 2004/0211751 (2004-10-01), Shuto et al.
patent: 2005/0155222 (2005-07-01), Nakamura
patent: 2004-87701 (2004-03-01), None
patent: 2004-235323 (2004-08-01), None
patent: 2005-63987 (2005-03-01), None
patent: 2005-236244 (2005-09-01), None

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