Method of manufacturing wire segments of homogeneous composition

Details Method of manufacturing wire segments of homogeneous composition Method of manufacturing wire segments of homogeneous composition

1998-05-27

2000-09-05

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228253, 29843, B23K 3512, H01R 900, H05K 300

Patent

active

061129763

ABSTRACT:
The disclosed invention provides for a method of manufacturing solder columns for particular use in attaching substrates to a printed circuit board. The method results in columns of homogeneous composition and thus overcomes problems associated with the phenomena of segregation. The method includes the steps of forming particles of the metal composition to be used for the columns from a molten source of the composition. The solid particles are then formed into segments of homogeneous composition by drawing ingots of the composition into wire and severing the wire into segments.

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