Method of manufacturing wire for use in a wire saw and wire for

Details Method of manufacturing wire for use in a wire saw and wire for Method of manufacturing wire for use in a wire saw and wire for

1997-03-20

1999-07-27

Gorgos, Kathryn

Metal deforming

By pulling workpiece through closed periphery die

29424, 451 28, 216 89, B21C 100

Patent

active

059271310

ABSTRACT:
A method of manufacturing wire for use in a wire saw used for slicing a semiconductor ingot into wafers is disclosed. A starting wire, which is an iron or iron alloy wire plated with copper or copper alloy, is drawn into a fine wire in a finish drawing step. Subsequently, copper or copper alloy plating is removed from the fine wire surface through chemical polishing with an acid treatment solution or a like solution, physical polishing with polishing cloth or the like, or electropolishing, or through combined polishing thereof. The method makes it possible to manufacture wire having excellent quality characteristics without raising a problem such as metal contamination of product wafers sliced from the ingot.

REFERENCES:
patent: 2293810 (1942-08-01), Carleton
patent: 3896043 (1975-07-01), Fadgen, Jr.
patent: 4246322 (1981-01-01), Wall et al.

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