Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1986-01-07
1988-09-27
Aftergut, Jeff H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
51283R, B24B 100, B24B 722
Patent
active
047739517
ABSTRACT:
A method of manufacturing wafers of semiconductor material incorporates the steps of: providing an elongated ingot of semiconductor material having a curved surface along the direction of elongation; mounting a structure for ingot mounting on each of the end surfaces of the ingot; positioning the ingot mounting structures on fixture structures to mount the ingot; and rotating the mounted ingot. The positioned ingot mounting structures are released and the ingot is removed from the fixture structures; however, during the course of the process the mounting structures are again positioned on fixture structures to mount the ingot and the ingot is rotated a second time. The method is adapted for accurate centering of the ingot during processing involving the sawing of the ingot to provide opposed elongated planes therealong (including rotation of the ingot in accomplishing such) and involving further rotation of the ingot during grinding. The ingot mounting structures are centered on the basis of crystallographic node lines that appear on the grown ingot. The mounting structures have spherical surface portions for accuracy in centering the ingot in fixtures having conical surface portions to abut the spherical surfaces in mounting the ingot.
REFERENCES:
patent: 3078549 (1963-02-01), Wende
patent: 3802412 (1974-04-01), Lane
patent: 4331452 (1982-05-01), Causey et al.
patent: 4487989 (1984-12-01), Wakefield et al.
Jackson Richard C.
Moffatt Alex P.
Aftergut Jeff H.
Atlantic Richfield Company
LandOfFree
Method of manufacturing wafers of semiconductor material does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing wafers of semiconductor material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing wafers of semiconductor material will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2396493