Method of manufacturing wafer level package including...

Details Method of manufacturing wafer level package including... Method of manufacturing wafer level package including...

2011-05-24

2011-05-24

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S113000, C438S114000

Reexamination Certificate

active

07947530

ABSTRACT:
The present invention relates to a method of manufacturing a wafer level package including the steps of: preparing a substrate wafer including a plurality of pads formed on a bottom surface, a plurality of chips positioned on a top surface, and dicing lines for dividing the chips; forming external connection units on the pads; coating resin on the dicing lines by positioning masks on the substrate wafer to expose only the dicing lines; removing the masks; encapsulating the chips positioned between the resin by coating the chips with encapsulant; removing the resin coated on the dicing lines; and cutting a wafer level package along the dicing lines exposed by removing the resin into units.

REFERENCES:
patent: 2000021823 (2000-01-01), None
patent: 100225324 (1999-07-01), None
patent: 1020020012060 (2002-02-01), None

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