Method of manufacturing two-layer printed circuit sheet

Details Method of manufacturing two-layer printed circuit sheet Method of manufacturing two-layer printed circuit sheet

1988-12-12

1990-03-20

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174262, 427 97, 428901, H01K 310

Patent

active

049089404

ABSTRACT:
An insulating sheet having through holes formed therein at positions where circuit patterns formed on its both surfaces are electrically connected is prepared. A sheet for forming a hole bottom is attached to one surface of the insulating sheet. Subsequently, a first-layer circuit pattern is printed on the other surface of the insulating sheet to which the hole-bottom sheet is not attached, and a conductive paste is filled into the holes. Thereafter, the hole-bottom sheet is removed. Then, a second-layer circuit pattern is printed on the surface of the insulating sheet, from which the hole-bottom sheet is removed. With this process, a two-layer printed circuit sheet is manufactured.

REFERENCES:
patent: 3077511 (1963-02-01), Bohrer et al.
patent: 4024629 (1977-05-01), LeMoine et al.
patent: 4249302 (1981-02-01), Crepeau
patent: 4604160 (1986-08-01), Murakami et al.
patent: 4663497 (1987-05-01), Reimann
patent: 4792646 (1988-12-01), Enomoto

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