Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1984-05-23
1986-01-28
Hearn, Brian E.
Metal working
Method of mechanical manufacture
Assembling or joining
29576B, 29590, 148 15, 148DIG10, H01L 21265
Patent
active
045661766
ABSTRACT:
A method of manufacturing a semiconductor device is set forth to provide a high-frequency bipolar transistor with very fine emitter-base geometry. The method comprises the steps of forming a base region, forming an insulating layer on the base region, and implanting emitter zones and base contact zones in windows in the insulating layer. Only emitter windows are first formed, then the emitter zones are implanted and a masking layer is provided on the insulating layer and in the emitter windows so that the base contact windows can be etched through apertures in the masking layer. The base contact zones are then implanted to the base contact windows.
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Sze, Physic of Semiconductor Devices 1981, John Wiley & Sons, Inc., pp. 165-169.
Moors Petrus M. A. W.
Uittenbogaard Teunis H.
Auyang Hunter L.
Hearn Brian E.
Miller Paul R.
U.S. Philips Corporation
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