Method of manufacturing thin film transistors and transistors ma

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29577C, 148 15, 357 4, 357 237, H01L 2978, H01L 2702

Patent

active

045451125

ABSTRACT:
An improved method of manufacturing thin film transistors. A gate metal is patterned to form a gate electrode and a drain, gate and source contact pad for the transistor. To reduce shorts and capacitance between the gate and the source or the drain, an intermetal dielectric is patterned to form a central portion over a planar portion of the gate region and to cover any exposed gate edges.

REFERENCES:
patent: 3852795 (1974-12-01), Ames
patent: 4282543 (1981-08-01), Ihara et al.
patent: 4415606 (1983-11-01), Cynkan et al.
patent: 4436582 (1984-03-01), Saxena
patent: 4459739 (1982-07-01), Shepherd et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing thin film transistors and transistors ma does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing thin film transistors and transistors ma, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing thin film transistors and transistors ma will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2212599

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.