Adhesive bonding and miscellaneous chemical manufacture – Methods
Patent
1974-03-20
1976-12-21
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
156 11, 156 24, 313309, 313336, 427 77, 427259, 427264, 427266, C23F 104, A47B 8800
Patent
active
039986780
ABSTRACT:
A method of manufacturing a thin-film field-emission electron source which is of a sandwich structure of a substrate - metallic film-insulating film - metallic film and which has at least one minute cavity and a field-emitter of, for example, a conical shape within the cavity, comprises the steps of (i) forming on a substrate a first layer of metallic film pattern for current supply, (ii) depositing a second layer film made of an electron emissive material onto the entire area of the substrate provided with the first layer, and thereafter subjecting the second layer film to a mesa etch by a photoetching process, to form a conical emitter on the first layer film, (iii) forming a third layer made of an insulating material, the third layer having a height substantially equal to the level of a tip portion of the emitter, (iv) forming a fourth layer of metallic film pattern as an accelerating electrode, and (v) etching the third layer, so as to expose the extremity of the emitter.
According to the manufacturing method, a thin-film field-emission electron source can be readily produced merely by the combination between the standard evaporation techniques and etching techniques.
REFERENCES:
patent: 3475664 (1969-10-01), De Vries
patent: 3506506 (1970-04-01), Pennebaker, Jr.
patent: 3531857 (1970-10-01), Iwamatsu
patent: 3665241 (1972-05-01), Spindt et al.
patent: 3700510 (1972-10-01), Keene et al.
patent: 3755704 (1973-08-01), Spindt et al.
IBM Tech. Discl. Bulletin, "Fabricating Monolithic Circuits," J. Gardiner et al., vol. 10, No. 5, Oct. 1967, pp. 655-656.
Fukase Shigeo
Kawabe Ushio
Hitachi , Ltd.
Leitten Brian J.
Powell William A.
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