Method of manufacturing thick-film resistor elements

Details Method of manufacturing thick-film resistor elements Method of manufacturing thick-film resistor elements

1995-05-11

1997-04-29

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Visible imaging including step of firing or sintering

430315, 430330, 427 58, 427102, 4271261, 432 13, G03F 700

Patent

active

056247826

ABSTRACT:
To provide a method of manufacturing thick-film resistor elements that forms thick-film resistors having a uniform thickness on a substrate surface with high precision.
A method of manufacturing thick-film resistor elements by applying a thick-film resistor composition, obtained by dispersing a conductive component and an inorganic binder in an organic medium and which has a specified rheology, through a clear relief image obtained by exposing, curing, and developing a resist layer of a photopolymerizable mixture formed on an insulating substrate according to the resist pattern, and the thick-film paste obtained at this time has almost the same thickness as the photopolymerizable layer on the surface of the insulating substrate and is patterned according to the high-precision pattern defined by the sharp, linear, lateral edge enclosed by the resist image removed by development.

REFERENCES:
patent: 3583931 (1971-06-01), Bouchard
patent: 4054483 (1977-10-01), Peiffer
patent: 5124234 (1992-06-01), Wakata et al.
patent: 5169493 (1992-12-01), Nii

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