Method of manufacturing thick-film devices

Details Method of manufacturing thick-film devices Method of manufacturing thick-film devices

1989-06-27

1991-02-19

Morgenstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427123, 4271262, 4271263, 427197, 427202, 427203, 427204, 264 60, 264 61, 264DIG6, B05D 512, C04B 3334

Patent

active

049943022

ABSTRACT:
To produce a layer in a multi-layer circuit structure, a "green ceramic tape" (16) comprising a sheet of particles of ceramic, glass ceramic, or a glass/ceramic composite in an organic binder is applied to a ceramic substrate (12) on which conductive paths (14) have been deposited. A slurry of hollow microspheres (20) is then deposited onto the green ceramic tape (16), and pressure is applied to drive the spheres into the tape. A further tape layer (22) is then applied, and the resultant structure is fired.

REFERENCES:
patent: 4134848 (1979-01-01), Adicoff et al.
patent: 4410874 (1983-10-01), Scapple et al.
patent: 4477492 (1984-10-01), Bergna et al.
patent: 4645552 (1987-02-01), Vitriol et al.
patent: 4781968 (1988-11-01), Kellerman
patent: 4865875 (1989-09-01), Kellerman
patent: 4867935 (1989-09-01), Morrison, Jr.
"Glass Spheres--High Strength Fillers for Plastics", Europlastics Monthly, Nov., 1973.

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