Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1980-06-17
1982-08-10
Morgenstern, Norman
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427102, 427103, 427123, 4271262, 427259, 427260, 427264, 427265, 427272, 427282, 427286, 427404, 4274193, 1566591, 156155, 156230, 156235, 156239, 4273761, 4273762, 4273833, 4273881, H05K 306
Patent
active
043438334
ABSTRACT:
An organic coating with slits or holes in a predetermined pattern is disposed on the surface of an electrically insulating substrate on which electrode leads have been formed. A paste of an electrically resistive material fills the slits or holes and is dried at 120.degree. to 140.degree. C. The surface of the paste is flush with that of the coating after which the paste preliminarily baked in a stream of oxygen at 500.degree. to 600.degree. C. while the coating is burnt off. The paste is fully baked at 800.degree. to 1000.degree. C. to form a heating resistor elements.
REFERENCES:
patent: 3764839 (1973-10-01), Fujimura
patent: 3801880 (1974-04-01), Harada et al.
patent: 3852563 (1974-12-01), Bohorquez et al.
patent: 3913091 (1975-10-01), Aizawa et al.
patent: 3948706 (1976-04-01), Schmeckenbecher
patent: 3984844 (1976-10-01), Tanno et al.
patent: 4119480 (1978-10-01), Nishi et al.
patent: 4204187 (1980-05-01), Kakuhashi et al.
Topfer, Thick Film Microelectronics, Van Nostrand Reinhold Co., N.Y. N.Y., 1971, pp. 28-31.
Towers, Hybrid Microcircuits, Pentech Press, London, 1977, pp. 45 and 133.
Endo Takafumi
Sawae Tetsunori
Tobita Toshio
Yamashita Hiromi
Bueker Richard
Mitsubishi Denki & Kabushiki Kaisha
Morgenstern Norman
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