Method of manufacturing the electronic using the anode junction

Details Method of manufacturing the electronic using the anode junction Method of manufacturing the electronic using the anode junction

1999-02-12

2000-10-17

Guay, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438118, 438123, 438124, 438127, H01L 2148

Patent

active

061330698

ABSTRACT:
An electronic component includes an inner lead having a tip with a projection; an insulating coating that is electrically conductive when heated disposed around the projection; and a metallic coating disposed around an electrode on a semiconductor chip, with a crater reaching the electrode, the projection engaging the crater to make a contact between the inner lead and the electrode, the insulating coating and the metallic coating being anodically bonded to each other.

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