Method of manufacturing tape automated bonding semiconductor pac

Details Method of manufacturing tape automated bonding semiconductor pac Method of manufacturing tape automated bonding semiconductor pac

1989-10-26

1992-10-20

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437206, 437217, 437220, 29830, 324158F, G01R 3128, H01L 2348

Patent

active

051569833

ABSTRACT:
This invention involves the selective plating of the outer leads in tape automated bonding section (TAB section). An inner and an outer gasket are mounted over, respectively, an inner and an outer portion of the outer leads and a voltage is applied to a common plane conductor. A barrier material, usually nickel, is applied to the outer leads protruding between the inner and the outer leads and then solder is applied over the nickel layer. The debus areas which connect all the outer leads to the common plane conductor are then excised from the TAB section which is now ready for final test.

REFERENCES:
patent: 3567999 (1971-03-01), Larson et al.
patent: 3781596 (1973-12-01), Galli et al.
patent: 3803483 (1974-04-01), McMahon, Jr.
patent: 3981070 (1976-09-01), Buelow et al.
patent: 4065851 (1978-01-01), Kummer et al.
patent: 4259436 (1981-03-01), Tabuchi et al.
patent: 4289922 (1981-09-01), Devlin
patent: 4498121 (1985-02-01), Breedis et al.
patent: 4504783 (1985-03-01), Zasis et al.
patent: 4510017 (1985-04-01), Barker
patent: 4763409 (1988-08-01), Takekawa et al.
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4874722 (1989-10-01), Bednarz et al.
patent: 4894605 (1990-01-01), Ringleb et al.
patent: 4897602 (1990-01-01), Lin et al.
patent: 4914741 (1990-04-01), Brown et al.
patent: 4975638 (1990-12-01), Evans et al.
patent: 4979663 (1990-12-01), Sofia et al.
patent: 5008614 (1991-04-01), Shreeve et al.

Affiliated with

Also associated with

Rating

Method of manufacturing tape automated bonding semiconductor pac does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing tape automated bonding semiconductor pac, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing tape automated bonding semiconductor pac will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-191675